HP 250 Epoxy, 400 mL, Cartridge, Straw
- High-performance, gap-filling thixotropic paste for structural bonding applications
- Superior toughness, impact and chemical resistant
- Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
- Excellent gap fill.
Specifications
Weight
16.63lb
Height
10.6in
Width
8.7in
Length
11.6in
Adhesive Tensile Shear
3,200 psi
Applicable Materials
Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
Application Temp. Range [Max]
250 °F
Application Temp. Range [Min]
-67°F
Applications
Multi-Purpose
Base Type
Epoxy
Brand
Devcon
Capacity Vol. [Nom]
400 mL
Category
Adhesives & Glues
Chemical Compound
Epoxy
Color
Straw
Dielectric Strength
490 V/mil
Elongation [Nom]
25%
Fix Cure Time @ Temp.
6 h @ 72°F
Flash Point [Nom]
200°F
Full Cure Time @ Temp.
7 d @ 72 °F
Hardness [Nom]
78 Shore D
Manufacturer
Devcon
Material
Thixotropic Paste
Odor/Scent
Low
Packing Type
Cartridge
Physical Form
Paste
Ratio
2:1
Resistance
Chlorinated Solvents; Kerosene; Moisture; Water; Weather
Specific Gravity [Nom]
1.0
Temp. Range [Max]
250 °F
Temp. Range [Min]
-67 °F
Tensile Strength [Nom]
3,200 psi
Type
Adhesive
Usage
Structural Bonding
Viscosity [Nom]
Resin: 120,000 cP; Hardener: 75,000 cP
Width [Nom]
400mL
Working Time [Nom]
65 min
Compare
HP 250 Epoxy, 400 mL, Cartridge, Straw
- High-performance, gap-filling thixotropic paste for structural bonding applications
- Superior toughness, impact and chemical resistant
- Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
- Excellent gap fill.